| Features |
This equipment provides fully automated acid etching, rinsing and cleaning of the wafer surface to remove the processed distortion layer that occurs after wafer cutting and polishing. |
Applications/
Implementation Results |
Semiconductor manufacturers |
| Keywords |
Etching, silicon, cutting, polishing, acetic acid, nitric acid, hydrofluoric acid, semiconductor, wafer |
| Related Divisions |
Advanced Equipment Division |
| Contact |
Currently Limited to Domestic Businesses |
| Reference Information |
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