| Features |
The wafer mounted to the carrier plate is inserted into the vacuum press, a high vacuum is generated, and air bubbles and distortions are removed from the wafer. |
Applications/
Implementation Results |
Semiconductor manufacturers |
| Keywords |
Semiconductor, wafer, vacuum press, full surface press, press |
| Related Divisions |
Advanced Equipment Division |
| Contact |
Currently Limited to Domestic Businesses |
| Reference Information |
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